Title :
Next Generation ASIC Packaging for High Performance Switches and Routers
Author_Institution :
Cisco Syst. Inc., San Jose
Abstract :
A collection of slides from author´s conference presentation is given.
Keywords :
application specific integrated circuits; electronics packaging; printed circuits; telecommunication network routing; telecommunication switching; ASIC packaging; PCB; daughter card; routers; switches; Application specific integrated circuits; Heat sinks; Packaging; Switches;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430560
