DocumentCode
2776145
Title
Ultra-violet (UV) curable hydrogels for biomedical electrode applications
Author
Meenan, B.J. ; Parker, M. ; McAdams, E.T. ; Zhou, M. ; McLaughlin, J.A. ; Anderson, J.McC.
Author_Institution
Sch. of Electr. & Mech. Eng., Ulster Univ., Newtownabbey, UK
Volume
1
fYear
1996
fDate
31 Oct-3 Nov 1996
Firstpage
104
Abstract
UV curable hydrogel formulations based on a photoinitiated polymerization cross-linking process have been prepared and cured. The chosen system is found to result in a high degree of polymerization with significant attendant adhesive characteristics. A degree of control of the effective UV-curing of the photo-reactive hydrogel system is found to result from adjustments to the curing exposure duration and the distance from the source to the sample. Variation of the amount of the photoinitiator is shown to cause changes in the properties of the cured material. The effectiveness of deliberate changes in the viscosity of the solutions, prior to UV curing, caused by the addition of polyvinylpyrrolidone (PVP) have also been studied. Electrical resistivity values for the various solutions, before and after UV curing, have been calculated and found to be commensurate with good quality commercially available hydrogel adhesives
Keywords
adhesion; biomedical equipment; electrical resistivity; electrodes; gels; polymerisation; viscosity; UV curable hydrogel formulations; adhesive characteristics; biomedical electrode applications; cured material properties; curing exposure duration; good quality commercially available hydrogel adhesives; photoinitiated polymerization cross-linking process; photoinitiator; polyvinylpyrrolidone; solution viscosity; Biomedical electrodes; Conductivity; Control systems; Curing; Frequency measurement; Lamps; Mechanical engineering; Polymer gels; Viscosity; Water;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1996. Bridging Disciplines for Biomedicine. Proceedings of the 18th Annual International Conference of the IEEE
Conference_Location
Amsterdam
Print_ISBN
0-7803-3811-1
Type
conf
DOI
10.1109/IEMBS.1996.656869
Filename
656869
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