Title :
Nano-structured Interconnects for System Integration
Author :
Aschenbrenner, R. ; Fiedler, S. ; Löher, T. ; Pahl, B. ; Becker, K.-F. ; Reichl, H.
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Berlin
Abstract :
A collection of slides from author´s conference presentation is given.
Keywords :
integrated circuit interconnections; nanoelectronics; nanoelectronics; nanolawn; nanostructured interconnects; reactive interconnect; system integration; Bonding; CMOS technology; Copper; Nanoscale devices; Nanostructured materials; Nanostructures; Packaging; Polymers; Temperature sensors; Wire;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430562
