Title :
Electromigration and thermomigration in flip chip solder joints
Author :
Tu, K.N. ; Huang, Annie ; Fau-Yi Ouvaug
Author_Institution :
UCLA, Los Angeles
Abstract :
The article consists of a Powerpoint presentation on electromigration and thermo migration in flip chip solder joints. The areas discussed include: electromigration; thermomigration; entropy production; microstructure refinement; flip chip solder joints; pancake-type void growth model; void formation; composite solder joint geometry; phase migration; non-isothermal aging; heat conduction and joule heating.
Keywords :
ageing; electromigration; entropy; flip-chip devices; heat conduction; reliability; soldering; thermal management (packaging); voids (solid); composite solder joint geometry; electromigration; entropy production; flip chip solder joints; heat conduction; joule heating; microstructure refinement; nonisothermal aging; pancake-type void growth model; phase migration; solder joint reliability; thermomigration; void formation; Aging; Electromigration; Entropy; Flip chip solder joints; Geometry; Microstructure; Production; Refining; Soldering; Solid modeling;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430563
