• DocumentCode
    2776213
  • Title

    System-In-Package Approach for Ultra-High-Power Semiconductor Devices

  • Author

    Chen, Jeffrey

  • Author_Institution
    President, NeoPac Lighting
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    21
  • Keywords
    Costs; Discrete wavelet transforms; Engines; Intersymbol interference; LED lamps; Light emitting diodes; Semiconductor device packaging; Semiconductor devices; Tellurium; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon, China
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430564
  • Filename
    4430564
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2776213