RF Property Variations on Plastic Packaging Due to Molding Compound Effects

Author

Tseng, Kun-Fu ; Hsion, Yi-Hsun ; Lwo, Ben-Je ; Yang, Min-I

Author_Institution

Chin-Min Inst. of Technol., Miao-Li

fYear

2006

fDate

11-14 Dec. 2006

Firstpage

1

Lastpage

4

Abstract

We compared the RF behaviors on a typical plastic packaging (100-lead PQFP) due to molding compound effects in this study. To this end, a testing fixture was first designed to cooperate the measurement on an Agilent 4287A RLC meter. The PQFP samples, both with and without molding compounds, were prepared afterward. Inductances and capacitances on the leads of the testing samples under microwave frequency operations were next measured and compared, respectively. It is concluded from the first measurements that the molding compound in a packaging will raise the capacitance values but it will not affect to the inductance of a packaging lead to bond wire under RF frequency.

Keywords

capacitance measurement; inductance measurement; moulding; plastic packaging; Agilent 4287A RLC meter; RF property variations; capacitance measurement; inductance measurement; molding compound effects; plastic packaging; Bonding; Capacitance measurement; Fixtures; Frequency measurement; Inductance measurement; Microwave frequencies; Microwave measurements; Plastic packaging; Radio frequency; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on

Conference_Location

Kowloon

Print_ISBN

978-1-4244-0834-4

Electronic_ISBN

978-1-4244-0834-4

Type

conf

DOI

10.1109/EMAP.2006.4430565

Filename

4430565