Title :
Impact of Electroless Nickel / Palladium / Immersion Gold Plating on Gold Ball Bond Reliability
Author :
Beng Teck Ng ; Ganesh, V.P. ; Lee, Charles
Author_Institution :
Infineon Technol. Asia Pacific Pte Ltd, Singapore
Abstract :
Gold (Au) wire bonding to aluminum (Al) bond pad leads to the formation of intermetallic compounds and associated Kirkendall voids at high temperature exposures. The objective of this work is to investigate the impact of utilizing electroless nickel/ electroless palladium / immersion gold (Ni/Pd/Au) and electroless nickel / immersion gold (Ni/Au) plating on Au wire bondability and ball bond reliability. With comparison to bonding on standard Al pad, the results reported in this paper include wire bonding process window, wire pull, ball bond shear, failure modes, high temperature storage (HTS) and cross-sections assessment.
Keywords :
electroless deposition; gold alloys; lead bonding; nickel alloys; palladium alloys; reliability; aluminum bond pad leads; associated Kirkendall voids; ball bond shear; electroless nickel/palladium/immersion gold plating; failure modes; gold ball bond reliability; gold wire bonding; high temperature storage; intermetallic compounds; Bonding processes; Gold; High temperature superconductors; Intermetallic; Nickel; Packaging; Palladium; Testing; Wafer bonding; Wire;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430573
