Impact of Electroless Nickel / Palladium / Immersion Gold Plating on Gold Ball Bond Reliability

Author

Beng Teck Ng ; Ganesh, V.P. ; Lee, Charles

Author_Institution

Infineon Technol. Asia Pacific Pte Ltd, Singapore

fYear

2006

fDate

11-14 Dec. 2006

Firstpage

1

Lastpage

4

Abstract

Gold (Au) wire bonding to aluminum (Al) bond pad leads to the formation of intermetallic compounds and associated Kirkendall voids at high temperature exposures. The objective of this work is to investigate the impact of utilizing electroless nickel/ electroless palladium / immersion gold (Ni/Pd/Au) and electroless nickel / immersion gold (Ni/Au) plating on Au wire bondability and ball bond reliability. With comparison to bonding on standard Al pad, the results reported in this paper include wire bonding process window, wire pull, ball bond shear, failure modes, high temperature storage (HTS) and cross-sections assessment.

Keywords

electroless deposition; gold alloys; lead bonding; nickel alloys; palladium alloys; reliability; aluminum bond pad leads; associated Kirkendall voids; ball bond shear; electroless nickel/palladium/immersion gold plating; failure modes; gold ball bond reliability; gold wire bonding; high temperature storage; intermetallic compounds; Bonding processes; Gold; High temperature superconductors; Intermetallic; Nickel; Packaging; Palladium; Testing; Wafer bonding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on

Conference_Location

Kowloon

Print_ISBN

978-1-4244-0834-4

Electronic_ISBN

978-1-4244-0834-4

Type

conf

DOI

10.1109/EMAP.2006.4430573

Filename

4430573