Analysis of on-chip antennas for high-speed signal transmission in silicon integrated circuits

Author

Kimoto, K. ; Sasaki, N. ; Kubota, S. ; Moriyama, W. ; Kikkawa, T.

Author_Institution

Res. Center for Nanodevices & Syst., Hiroshima Univ., Higashi-Hiroshima

fYear

2008

fDate

5-11 July 2008

Firstpage

1

Lastpage

4

Abstract

Transmission characteristics of on-chip integrated dipole antennas were investigated and analyzed in terms of antenna length, transmission distance and Si substrate resistivity for wireless interconnection in 3-D packaging of LSI chips. In lower frequency range less than 2 GHz, the dominant path of signal was in Si substrate. On the other hand, signal paths were direct wave in air and surface wave in Si in high frequency range from 9.5 GHz to 30 GHz. The transmission coefficient could be improved from -60 dB to -10 dB by use of high resistivity Si substrate.

Keywords

dipole antennas; microwave antennas; monolithic integrated circuits; radiofrequency integrated circuits; antenna length; antenna transmission distance; frequency 9.5 GHz to 30 GHz; high-speed signal transmission; onchip integrated dipole antennas; silicon integrated circuits; wireless interconnection; Conductivity; Dipole antennas; Frequency; High speed integrated circuits; Integrated circuit interconnections; Integrated circuit packaging; Large scale integration; Signal analysis; Silicon; Transmitting antennas;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2008. AP-S 2008. IEEE

Conference_Location

San Diego, CA

Print_ISBN

978-1-4244-2041-4

Electronic_ISBN

978-1-4244-2042-1

Type

conf

DOI

10.1109/APS.2008.4619864

Filename

4619864