DocumentCode :
2777174
Title :
Electromagnetic compatibility of two novel packaging concepts of an inductively powered neural interface
Author :
Kim, Sohee ; Wilke, Martin ; Klein, Matthias ; Toepper, Michael ; Solzbacher, Florian
Author_Institution :
Dept. of Electr. & Comput. Eng., Utah Univ., Salt Lake, UT
fYear :
2007
fDate :
2-5 May 2007
Firstpage :
434
Lastpage :
437
Abstract :
For implantable neuroprosthetic devices, reliable packaging of the device is one of the requirements. Selection of proper packaging material and design is essential to protect the device from moist fluidic environment in the body as well as not to cause any harm to the implanted tissue. In particular, packaging needs to be designed carefully when the device operates wirelessly through inductive coupling between two coils, since the packaging could degrade the power transmission due to the losses in the packaging itself. In this study, the influence of the proposed packaging methods on the magnetic power transmission was investigated using numerical simulations with the help of finite element analysis. The simulation showed that both proposed packaging concepts of using a silicon lid and LTCC ferrite lid do not degrade the power transmission significantly at the selected frequency of 2.64 MHz.
Keywords :
electromagnetic compatibility; finite element analysis; medical computing; neurophysiology; prosthetics; 2.64 MHz; electromagnetic compatibility; ferrite lid; finite element analysis; inductively powered neural interface; magnetic power transmission; moist fluidic environment; neuroprosthetic devices; numerical simulations; packaging concepts; silicon lid; Biological materials; Coils; Couplings; Degradation; Electromagnetic compatibility; Neural prosthesis; Packaging; Power transmission; Propagation losses; Protection;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Neural Engineering, 2007. CNE '07. 3rd International IEEE/EMBS Conference on
Conference_Location :
Kohala Coast, HI
Print_ISBN :
1-4244-0792-3
Electronic_ISBN :
1-4244-0792-3
Type :
conf
DOI :
10.1109/CNE.2007.369702
Filename :
4227307
Link To Document :
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