InP and silica photonic integrated circuits for high spectral efficiency fiber-optic communications

Author

Doerr, C.R.

Author_Institution

Bell Labs., Alcatel-Lucent, Holmdel, NJ, USA

fYear

2009

fDate

14-19 June 2009

Firstpage

1

Lastpage

1

Abstract

This talk will focus on silica PICs and InP PICs. Silica PICs are well suited for in-line components, which must be low loss and can have slow dynamics. InP PICs are well suited for transmitters and receivers, which must provide light generation/amplification, high-speed modulation, and high-speed reception. For silica PICs we will discuss optical equalizers, which can correct for the intersymbol interference commonly encountered in high spectral efficiency systems; interleavers for ultra-narrow channel spacings; demodulators for differential quadrature phase-shift keying (DQPSK); and modulators built using a combination of silica and LiNbO₃.

Keywords

III-V semiconductors; channel spacing; differential phase shift keying; equalisers; high-speed optical techniques; indium compounds; integrated optoelectronics; intersymbol interference; lithium compounds; optical communication equipment; optical fibre communication; optical modulation; silicon compounds; InP; LiNbO₃; SiO₂; differential quadrature phase-shift keying; fiber-optic communication; high-spectral efficiency; high-speed modulation; high-speed reception; intersymbol interference; light generation; optical demodulator; optical equalizer; optical receiver; optical transmitter; silica photonic integrated circuit; ultra-narrow channel spacing; High speed optical techniques; Indium phosphide; Optical fiber communication; Optical losses; Optical modulation; Optical receivers; Optical transmitters; Photonic integrated circuits; Silicon compounds; Stimulated emission;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics 2009 and the European Quantum Electronics Conference. CLEO Europe - EQEC 2009. European Conference on

Conference_Location

Munich

Print_ISBN

978-1-4244-4079-5

Electronic_ISBN

978-1-4244-4080-1

Type

conf

DOI

10.1109/CLEOE-EQEC.2009.5191634

Filename

5191634