DocumentCode :
2777284
Title :
High Temperature Behaviour of Ceramic Substrates for Power Electronics Integration
Author :
Dagdag, S. ; Lebey, Th ; Dinculescu, Sorin ; Locatelli, M.-L. ; Dutarde, E.
Author_Institution :
Univ. Paul Sabatier, Toulouse
fYear :
2006
fDate :
11-14 Dec. 2006
Firstpage :
1
Lastpage :
5
Abstract :
A new criterion allowing for the choice of the most appropriate substrate for high voltage high temperature power electronics applications is introduced. Different insulating materials (A1N, Alumina and BN) are tested up to 450degC regarding their dielectric strength. These results are presented and discussed.
Keywords :
ceramic insulation; electric strength; high-temperature electronics; insulator testing; power electronics; substrates; ceramic substrates; high-voltage high-temperature power electronics integration; insulating material testing; Ceramics; Dielectric breakdown; Dielectric materials; Dielectric substrates; Power electronics; Semiconductor materials; Surface resistance; Temperature; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
Type :
conf
DOI :
10.1109/EMAP.2006.4430617
Filename :
4430617
Link To Document :
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