Title :
3D/SiP Key Process Technology Trend
Author_Institution :
Grand Joint Technology Ltd, onishite@netvigator.com
Abstract :
A collection of slides from author´s conference presentation is given.
Keywords :
grinding; lead bonding; sputter etching; stress effects; system-in-package; wafer bonding; wafer level packaging; die bonding; plasma etching; stacked die; stress relief; system in package; thin wafer technology; wafer tinning; wire bonding; Blades; Etching; Global Positioning System; Packaging; Plasma applications; Stress; Surface cracks; Wire;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430627
