Title :
Effect of defects on thermal performance of carbon nanotube investigated by molecular dynamics simulation
Author :
Fan, Haibo ; Zhang, Kai ; Yuen, Matthew M F
Author_Institution :
Hong Kong Univ. of Sci. & Technol., Hong Kong
Abstract :
The present study was focused on the investigation of effect of defects on the CNT thermal performance. In order to investigate effect of defects on the material properties of the CNT, MD models were built using the Materials studio software (Accelrys, Inc). In this study, a series of MD models were built to simulate the effect of defects on thermal performance of the SWCNT. Based on Fourier´s law, thermal conductivities of the SWCNT with different kinds of defects were calculated. The MD simulation results showed that defects in the CNT had heavily effects on thermal conductivity of SWCNT. The thermal conductivity of SWCNT was drastically reduced by those defects. This MD simulation gave a basic understanding of the effect of defects on material performance of CNTs and provided information for the future study.
Keywords :
carbon nanotubes; design engineering; molecular dynamics method; thermal conductivity; thermal management (packaging); CNT defects; Fourier´s law; Materials studio software; adhesion; carbon nanotube; electronic packaging; material properties; molecular dynamics simulation; thermal conductivities; thermal performance; Adhesives; Carbon nanotubes; Conducting materials; Electronic packaging thermal management; Electronics packaging; Heat sinks; Material properties; Temperature; Thermal conductivity; Thermal degradation;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430651
