Title :
Advanced soldering paste suitable for Package-on-Package process
Author :
Maeda, T. ; Sakai, T. ; Sakemi, S. ; Ishibashi, K.
Abstract :
PoP technology is emerging as an alternative solution to SiP since it has advantage of easier testing and sourcing Flux-dipping PoP has risk of cold open joints due to package reflow warpage. Controlling warpage is challenging especially when top/bottom package come from different suppliers. New SMT paste STAMP was developed to enlarge process window of PoP stacking. The paste consists of higher m.p. metal flakes uniformly dispersed in flux, which is effective to fill ball-pad gap. SMT trial showed better PoP stacking yield of STAMP. Also, BLR of STAMP-build PoP was as good as flux- build PoP.
Keywords :
electronics packaging; mobile radio; reflow soldering; soldering; solders; PoP stacking; SMT paste; STAMP-build PoP; cell phone packaging; package reflow; package-on-package technology; soldering paste; sourcing flux-dipping PoP; warpage control; Cleaning; Costs; Manufacturing processes; Packaging; Production facilities; Resins; Soldering; Surface-mount technology; Testing; Tin;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0833-7
DOI :
10.1109/EMAP.2006.4430659
