• DocumentCode
    2778095
  • Title

    Development and characterizations of low cost accelerometers

  • Author

    Mui, M.K. ; LAM, David CC

  • Author_Institution
    Hong Kong Univ. of Sci. & Technol., Kowloon
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Accelerometers developed originally for uses in military, navigation and automotive applications but are finding applications in pointing devices and game pads. The proliferation of accelerometers in consumer products depends on the availability of low cost accelerometers. In this investigation, consumer-based non-silicon accelerometers are designed and fabricated for sensing human motions and gestures. A capacitive motion sensor was designed and fabricated using organic substrate technologies. The prototypes are designed to have a dynamic range of plusmn5g and a bandwidth from 0 to 20 Hz, which covers the range of accelerations for human limbs. The performance of the prototype was benchmarked against existing accelerometers. Since the organic materials are less robust compared to silicon, the thermal behaviors of the prototype sensors were analyzed using FEM and experimentally characterized. The results showed that the prototypes´ sensing capabilities and stabilities are suitable for use in consumer applications.
  • Keywords
    accelerometers; biomechanics; biomedical measurement; capacitive sensors; finite element analysis; motion measurement; organic compounds; printed circuits; thermal analysis; thermal stability; FEM; Printed Circuit Board accelerometers; capacitive motion sensor; consumer-based nonsilicon accelerometers; frequency 0 Hz to 20 Hz; human gestures; human limb accelerations; human motions sensing; low cost accelerometers characterizations; organic substrate technologies; stabilities aspects; thermal behaviors; Accelerometers; Automotive applications; Bandwidth; Capacitive sensors; Consumer products; Costs; Dynamic range; Humans; Navigation; Prototypes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430664
  • Filename
    4430664