Title :
On-chip bond-wire antennas on CMOS-grade silicon substrates
Author :
Varanasi, Niharika ; Jung, Byunghoo ; Peroulis, Dimitrios
Author_Institution :
Purdue Univ., West Lafayette, IN
Abstract :
The paper introduces a novel concept of using metal bond-wires as on-chip antennas on low resistivity CMOS-grade silicon substrate based ICs. Simulation results indicate that bond-wires, which can be readily realized with high-precision industry-standard tools, can indeed be used as on-chip antennas operating from 30-60 GHz. In particular, the paper examines the input impedance and radiation characteristics of a bond-wire antenna operating at 30 GHz, using the ANSOFT high frequency structure simulator (HFSS) program employing the full-wave finite element method. The results show a minimum return loss of 14.24 dB and a gain of 0.22 dBi at 33.8 GHz. The radiation efficiency of the antenna is 74%, which is considerably higher than standard on-chip antennas.
Keywords :
CMOS integrated circuits; antenna radiation patterns; finite element analysis; impedance matching; millimetre wave antennas; ANSOFT high frequency structure simulator; CMOS-grade silicon substrates; Si; bond-wire antennas; efficiency 74 percent; frequency 30 GHz to 60 GHz; impedance matching; on-chip antennas; radiation efficiency; radiation pattern; Bonding; CMOS technology; Circuits; Computational modeling; Computer simulation; Conductivity; Dielectric substrates; Impedance; Radio frequency; Silicon;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2008. AP-S 2008. IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-2041-4
Electronic_ISBN :
978-1-4244-2042-1
DOI :
10.1109/APS.2008.4619926
