DocumentCode
277834
Title
Optimising the design of high power semiconductor packaging for integrated power devices
Author
Dunn, T.M. ; Bassett, R.J.
Author_Institution
Power Semicond. Div., GEC Plessey Semicond., Coventry, UK
fYear
1991
fDate
33253
Firstpage
42370
Lastpage
42373
Abstract
Discusses the application of power semiconductors where users place many demands on the semiconductor manufacturer. Designing the actual semiconductor itself is one problem. Packaging it in a usable form presents a further new set of conflicting requirements. Introducing intelligence adds yet more to the problems of packaging
Keywords
packaging; power electronics; design optimisation; high power semiconductor packaging; integrated power devices; intelligence; power semiconductors; semiconductor manufacturer;
fLanguage
English
Publisher
iet
Conference_Titel
Integrated Power Devices, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
180810
Link To Document