Title :
Optimising the design of high power semiconductor packaging for integrated power devices
Author :
Dunn, T.M. ; Bassett, R.J.
Author_Institution :
Power Semicond. Div., GEC Plessey Semicond., Coventry, UK
Abstract :
Discusses the application of power semiconductors where users place many demands on the semiconductor manufacturer. Designing the actual semiconductor itself is one problem. Packaging it in a usable form presents a further new set of conflicting requirements. Introducing intelligence adds yet more to the problems of packaging
Keywords :
packaging; power electronics; design optimisation; high power semiconductor packaging; integrated power devices; intelligence; power semiconductors; semiconductor manufacturer;
Conference_Titel :
Integrated Power Devices, IEE Colloquium on
Conference_Location :
London
