DocumentCode
2778503
Title
Junction Capacitance Test-An INNOVATIVE Design of "Bond-off" Detection
Author
Zhu, Benpeng
Author_Institution
Philips Semicond. Guangdong Co., Ltd., Dongguan
fYear
2006
fDate
11-14 Dec. 2006
Firstpage
1
Lastpage
37
Abstract
In 2005 , PSG1 SOT54 Glue line generated 2 cases of justified "bond off" customer complaints from BT169 product. We have defined several improvement actions in our 8D reports, but was unable to come up with an effective real-time monitoring on "bond off" defect. In line with Philips Semiconductors\´ Zero Defect Quality Improvement Initiative, by working closely with our wire bonder manufacturer, ITEC, we acquired 12 sets of "bond-off" detector kits in mid-2005. However, they failed to effectively monitor this defect despite after 6 months of troubleshooting by ITEC experts.
Keywords
adhesive bonding; bond off customer complaint; bond off defect; bond off detection; junction capacitance test; Bonding; Capacitance; Circuits; Gold; Impedance; Logic; Negative feedback; Resistors; Testing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location
Kowloon
Print_ISBN
978-1-4244-0834-4
Electronic_ISBN
978-1-4244-0834-4
Type
conf
DOI
10.1109/EMAP.2006.4430687
Filename
4430687
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