• DocumentCode
    2778645
  • Title

    Mechanical and Electrical Characterisation of Individual ACA Conductor Particles

  • Author

    Dou, Guangbin ; Whalley, David ; Liu, Changqing

  • Author_Institution
    Loughborough Univ., Loughborough
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    Anisotropic conductive adhesives (ACAs) consist of a polymer adhesive matrix containing fine conductive particles. The primary objective of this experimental research is to establish a clearer understanding of the effects of the bonding force on the deformation of individual ACA particles and their resulting conductivity when in contact with an appropriate metallic surface. This has been achieved through simultaneous measurements of the deformation and electrical resistance whilst applying force using a specially configured nano-indenter machine, where the "indenter", instead of being pointed, had a flat tip about 20-30 mum in diameter. The merit of using this machine is that very small forces, of the order of 100 mN, can be accurately applied to the particles to a resolution of 100 nN and the resulting deformations, of less than 6 mum, can then be recorded to a resolution of 0.1 nm. The results showed that the ACA particle deformation was nonlinear and that the force/deformation at which particle crushing occurs was affected by the load rate. The resistance was observed to decrease as the deformation increased up to the crush point at which stage it increased slightly. The voltage versus current behaviour of a deformed ACA particle was also found to be linear.
  • Keywords
    adhesive bonding; conducting polymers; conductive adhesives; deformation; electric resistance; electronics packaging; indentation; nanotechnology; anisotropic conductive adhesives; bonding force; deformation; electrical characterisation; electrical resistance; fine conductive particles; mechanical characterisation; nanoindenter machine; particle crushing; particle deformation; polymer adhesive matrix; Anisotropic magnetoresistance; Bonding forces; Conductive adhesives; Conductivity; Conductors; Contacts; Electrical resistance measurement; Force measurement; Polymers; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430697
  • Filename
    4430697