Title :
Mechanical and Electrical Characterisation of Individual ACA Conductor Particles
Author :
Dou, Guangbin ; Whalley, David ; Liu, Changqing
Author_Institution :
Loughborough Univ., Loughborough
Abstract :
Anisotropic conductive adhesives (ACAs) consist of a polymer adhesive matrix containing fine conductive particles. The primary objective of this experimental research is to establish a clearer understanding of the effects of the bonding force on the deformation of individual ACA particles and their resulting conductivity when in contact with an appropriate metallic surface. This has been achieved through simultaneous measurements of the deformation and electrical resistance whilst applying force using a specially configured nano-indenter machine, where the "indenter", instead of being pointed, had a flat tip about 20-30 mum in diameter. The merit of using this machine is that very small forces, of the order of 100 mN, can be accurately applied to the particles to a resolution of 100 nN and the resulting deformations, of less than 6 mum, can then be recorded to a resolution of 0.1 nm. The results showed that the ACA particle deformation was nonlinear and that the force/deformation at which particle crushing occurs was affected by the load rate. The resistance was observed to decrease as the deformation increased up to the crush point at which stage it increased slightly. The voltage versus current behaviour of a deformed ACA particle was also found to be linear.
Keywords :
adhesive bonding; conducting polymers; conductive adhesives; deformation; electric resistance; electronics packaging; indentation; nanotechnology; anisotropic conductive adhesives; bonding force; deformation; electrical characterisation; electrical resistance; fine conductive particles; mechanical characterisation; nanoindenter machine; particle crushing; particle deformation; polymer adhesive matrix; Anisotropic magnetoresistance; Bonding forces; Conductive adhesives; Conductivity; Conductors; Contacts; Electrical resistance measurement; Force measurement; Polymers; Surface resistance;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430697