Title :
Influence of Ni-Sn-Cu ternary intermetallic compound on solder joint reliability
Author :
Tu, Yunhua ; Liu, Sang ; Ye, Yuming ; Chen, Limin
Author_Institution :
Huawei Technol. Co., Ltd., Shenzhen
Abstract :
A collection of slides from the author´s conference presentation is given.
Keywords :
copper alloys; nickel alloys; reliability; solders; tin alloys; solder joint reliability; ternary intermetallic compound; Cooling; Copper; Diffraction; Etching; Finishing; Intermetallic; Soldering; Surface cracks; Surface morphology; US Department of Transportation;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430698
