• DocumentCode
    2778657
  • Title

    Influence of Ni-Sn-Cu ternary intermetallic compound on solder joint reliability

  • Author

    Tu, Yunhua ; Liu, Sang ; Ye, Yuming ; Chen, Limin

  • Author_Institution
    Huawei Technol. Co., Ltd., Shenzhen
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    23
  • Abstract
    A collection of slides from the author´s conference presentation is given.
  • Keywords
    copper alloys; nickel alloys; reliability; solders; tin alloys; solder joint reliability; ternary intermetallic compound; Cooling; Copper; Diffraction; Etching; Finishing; Intermetallic; Soldering; Surface cracks; Surface morphology; US Department of Transportation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430698
  • Filename
    4430698
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2778657