Analysis of SMT Residues after Reflow

Author

Chaoyun, Luo ; Sang, Liu ; Cui, Zhang ; Hongchun, Zhang ; Jifan, Wan ; Xin, Zhong

Author_Institution

Huawei Technol. Co. Ltd., Shenzhen

fYear

2006

fDate

11-14 Dec. 2006

Firstpage

1

Lastpage

21

Abstract

The article consists of a Powerpoint presentation on a analysis of SMT residues after reflow. The paper concludes that the residues can reduce the SIR, change normal appearances, make error report in ICT testing, decrease curing degree of under-fill and disturb the high frequency and high velocity signal; analyzing the solder paste pre-reflow and post-reflow by DSC, TGA, FTIR and GC/MS, the testing results show the flux residues on board are rosin primary, high boiling point solvent and UV absorber and it reveal the no-clean process is safe, but the residues must be controlled for the high performance and high reliability boards.

Keywords

Fourier transform spectroscopy; differential scanning calorimetry; infrared spectroscopy; integrated circuit testing; reflow soldering; surface mount technology; thermal analysis; DSC; FTIR; GC-MS; ICT testing; SMT residues; TGA; UV absorber; flux residues; high boiling point solvent; no-clean process; reflow soldering; rosin primary; Curing; Error correction; Frequency; Performance analysis; Signal analysis; Signal processing; Solvents; Surface-mount technology; Testing; Velocity control;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on

Conference_Location

Kowloon

Print_ISBN

978-1-4244-0834-4

Electronic_ISBN

978-1-4244-0834-4

Type

conf

DOI

10.1109/EMAP.2006.4430699

Filename

4430699