The influence of reflow peak temperature on BGA solder joints´ mechanical reliability in backside compatible soldering

Author

Chen, Limin ; Liu, Sang ; Ye, Yuming ; Tu, Yunhua ; Song, Zhiwei ; Xiang, Zhao ; Xu, Zhi

Author_Institution

Huawei Technol. Co. Ltd., Shenzhen

fYear

2006

fDate

11-14 Dec. 2006

Firstpage

1

Lastpage

22

Abstract

The article consists of a Powerpoint presentation on BGA solder joints´ mechanical reliability in backside compatible soldering. The paper concludes that the solder joints´ mechanical property in backside compatible soldering is as good as pure lead-free assembly; The failure location of solder joint in component shearing test is between solder pad and resin; The failure location in multi-time 4-points bending test is on the pad connected to lines; Taking 220degC as reflow peak temperature can get good Pb uniformity in solder joint; The reliability conclusion of mixed soldering mainly depends on ATC result.

Keywords

ball grid arrays; bending; fault diagnosis; mechanical testing; reflow soldering; reliability; solders; BGA solder joints; backside compatible soldering; component shearing test; failure location; mechanical reliability; mixed soldering; multitime 4-points bending test; pure lead-free assembly; reflow peak temperature; Assembly; Fixtures; Mechanical factors; Resins; Soldering; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on

Conference_Location

Kowloon

Print_ISBN

978-1-4244-0834-4

Electronic_ISBN

978-1-4244-0834-4

Type

conf

DOI

10.1109/EMAP.2006.4430700

Filename

4430700