Title :
Vacuum packaging using anodic bonding and emission characteristics of FED
Author :
Lee, Duck-Jung ; Ju, Byeong-Kwon ; Jeong, Jee-Won ; Kim, Hoon ; Jung, Sung-Jae ; Jang, Jin ; Oh, Myung-Hwan
Author_Institution :
Electron. Mater. & Devices Res. Centre, Korea Inst. of Sci. & Technol., Seoul, South Korea
Abstract :
In this paper, we suggest an FED packaging technology using the anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonding. The glass-glass bonding is based on conventional silicon-glass bonding mechanism and was achieved successfully. The FED panel having an opened exhausting hole was formed by the glass frit process and sealed by capping glass. From leak test in a bonded interface, the inner pressure of panel was kept continuously during pumping out. A light emission was observed from the packaged 0.7-inch FED and the anode current was 34 μA. Emission stability was constantly measured for 11 hours
Keywords :
field emission displays; seals (stoppers); semiconductor device packaging; 34 muA; I-V characteristic; amorphous silicon film; anode current; anodic bonding; capping glass seal; emission characteristics; emission stability; field emission display; glass frit process; glass substrate; glass-glass bonding; leak test; panel inner pressure; silicon-glass bonding mechanism; vacuum packaging; Amorphous silicon; Anodes; Bonding; Cathodes; Glass; Packaging; Semiconductor films; Stability; Substrates; Testing;
Conference_Titel :
Information Display, 1999. ASID '99. Proceedings of the 5th Asian Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
957-97347-9-8
DOI :
10.1109/ASID.1999.762712
