DocumentCode :
2779457
Title :
Printed Circuit Board Assembly/soldering Initiatives At Penn State
Author :
Lehtihet, E.A.
Author_Institution :
Penn State University, University Park Pa, 16802
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
169
Lastpage :
173
Keywords :
Assembly; Design engineering; Electronics industry; Laboratories; Manufacturing industries; Manufacturing processes; Printed circuits; Reliability engineering; Soldering; Surface-mount technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639884
Filename :
639884
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2779457
بازگشت