Title :
Printed Circuit Board Assembly/soldering Initiatives At Penn State
Author_Institution :
Penn State University, University Park Pa, 16802
Keywords :
Assembly; Design engineering; Electronics industry; Laboratories; Manufacturing industries; Manufacturing processes; Printed circuits; Reliability engineering; Soldering; Surface-mount technology;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
DOI :
10.1109/IEMT.1992.639884