DocumentCode :
2779659
Title :
Design, modeling and simulation methodology for PCI-X subsystems
Author :
Cases, M. ; Pham, N.
Author_Institution :
IBM Corp., Austin, TX, USA
fYear :
2000
fDate :
2000
Firstpage :
33
Lastpage :
36
Abstract :
This paper describes an electrical design, modeling and simulation methodology for high-speed I/O subsystems utilizing an extension of the peripheral component interface specifications (PCI-X). Actual system configurations and timing specifications are used to describe the design methodology, and to optimize the timing equations for the system level interconnects. The timing budget and noise margin allocation for the various components of the optimization equations are discussed in conjunction with their associated critical design parameters including hot plug requirements
Keywords :
design engineering; digital simulation; interconnections; noise; optimisation; peripheral interfaces; timing; PCI-X; PCI-X subsystems; critical design parameters; design; design methodology; electrical design; high-speed I/O subsystems; hot plug requirements; modeling; noise margin allocation; optimization equations; peripheral component interface specifications extension; simulation methodology; system configurations; system level interconnects; timing budget; timing equations optimization; timing specifications; Bandwidth; Clocks; Crosstalk; Delay effects; Design methodology; Design optimization; Equations; Frequency; Propagation delay; Timing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
Type :
conf
DOI :
10.1109/EPEP.2000.895487
Filename :
895487
Link To Document :
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