Computation and effect of field penetration through planes in multi-layered package power distribution networks for giga-processors

Author

Mao, Jifeng ; Srinivasan, Jegannathan ; Chio, Jinseong ; Do, Nhon ; Swaminathan, Madhavan

Author_Institution

Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2000

fDate

2000

Firstpage

43

Lastpage

46

Abstract

This paper discusses the field penetration through planes in package power distribution networks. A method is presented to efficiently compute the penetration of magnetic fields through an `N´ layer structure by solving Maxwell´s equations. Several test cases have been simulated to compute the frequency and time domain response and their effect on the functioning of giga-processors. General rules have been proposed to suppress this phenomenon

Keywords

Maxwell equations; frequency-domain analysis; integrated circuit interconnections; integrated circuit packaging; magnetic fields; microprocessor chips; power supply circuits; time-domain analysis; Maxwell´s equations; N layer structure; field penetration; frequency domain response; giga-processors; magnetic field penetration; multi-layered package power distribution networks; package power distribution networks; time domain response; Cavity resonators; Conductivity; Conductors; Distributed computing; Frequency; Magnetic fields; Maxwell equations; Microprocessors; Packaging; Power systems;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Conference_Location

Scottsdale, AZ

Print_ISBN

0-7803-6450-3

Type

conf

DOI

10.1109/EPEP.2000.895489

Filename

895489