Power plane SPICE models for frequency and time domains

Author

Smith, Larry ; Roy, Tanmoy ; Anderson, Raymond

Author_Institution

Sun Microsyst. Inc., Palo Alto, CA, USA

fYear

2000

fDate

2000

Firstpage

51

Lastpage

54

Abstract

A SPICE model for power plane simulation has been developed. It is based on the geometries and materials of the power planes and uses a unit cell composed of RLC elements, transmission line elements or the W-element. Important frequency and time domain properties are demonstrated through simulation, and model to hardware correlation is established in both domains

Keywords

SPICE; circuit simulation; frequency-domain analysis; integrated circuit modelling; integrated circuit packaging; power supply circuits; time-domain analysis; transmission line theory; RLC elements; SPICE model; W-element; frequency domain; frequency domain properties; model to hardware correlation; power plane SPICE models; power plane geometry; power plane materials; power plane simulation; simulation; time domain; time domain properties; transmission line elements; unit cell; Capacitance; Circuit simulation; Conducting materials; Dielectric losses; Electric resistance; Impedance; Inductance; Power transmission lines; RLC circuits; SPICE;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Conference_Location

Scottsdale, AZ

Print_ISBN

0-7803-6450-3

Type

conf

DOI

10.1109/EPEP.2000.895491

Filename

895491