Title :
Power plane SPICE models for frequency and time domains
Author :
Smith, Larry ; Roy, Tanmoy ; Anderson, Raymond
Author_Institution :
Sun Microsyst. Inc., Palo Alto, CA, USA
Abstract :
A SPICE model for power plane simulation has been developed. It is based on the geometries and materials of the power planes and uses a unit cell composed of RLC elements, transmission line elements or the W-element. Important frequency and time domain properties are demonstrated through simulation, and model to hardware correlation is established in both domains
Keywords :
SPICE; circuit simulation; frequency-domain analysis; integrated circuit modelling; integrated circuit packaging; power supply circuits; time-domain analysis; transmission line theory; RLC elements; SPICE model; W-element; frequency domain; frequency domain properties; model to hardware correlation; power plane SPICE models; power plane geometry; power plane materials; power plane simulation; simulation; time domain; time domain properties; transmission line elements; unit cell; Capacitance; Circuit simulation; Conducting materials; Dielectric losses; Electric resistance; Impedance; Inductance; Power transmission lines; RLC circuits; SPICE;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895491
