Multi-layer fully organic-based system on package (SOP) technology for RF applications

Author

Davis, M.F. ; Sutono, A. ; Lim, K. ; Laskar, J. ; Tummala, R.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2000

fDate

2000

Firstpage

103

Lastpage

106

Abstract

We present the development and characterization of multi-layer fully organic-based system-on-package (SOP) technology, referred to as the single level integrated module (SLIM), for RF applications. A multi-layer transceiver architecture and a hybrid microstrip and coplanar waveguide interconnect scheme have been proposed and developed to allow high density interconnects. Coplanar waveguide transmission line test structures have been fabricated on the multi-layer material system and demonstrate an insertion loss of 1.4 dB/in at 13 GHz and a return loss better than 15 dB at 13 GHz

Keywords

MMIC; coplanar transmission lines; coplanar waveguides; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; losses; modules; transceivers; 13 GHz; 15 dB; RF applications; SLIM; coplanar waveguide transmission line test structures; high density interconnects; hybrid microstrip/coplanar waveguide interconnect scheme; insertion loss; multi-layer fully organic-based SOP technology; multi-layer fully organic-based system-on-package technology; multi-layer material system; multi-layer transceiver architecture; return loss; single level integrated module; Coplanar transmission lines; Coplanar waveguides; Insertion loss; Materials testing; Microstrip; Packaging; Propagation losses; Radio frequency; System testing; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Conference_Location

Scottsdale, AZ

Print_ISBN

0-7803-6450-3

Type

conf

DOI

10.1109/EPEP.2000.895503

Filename

895503