DocumentCode :
2779969
Title :
Optimizing VNA measurements by cascaded transmission lines for interconnect characterization
Author :
Huang, Ching-Chao ; Feng, June
Author_Institution :
Rambus Inc., Mountain View, CA, USA
fYear :
2000
fDate :
2000
Firstpage :
107
Lastpage :
110
Abstract :
This paper models arbitrary interconnect structures by frequency-dependent coupled transmission lines in cascade. By optimizing the input impedance of shorted structures, we show that the RLGC parameters can be extracted reliably from the vector network analyzer (VNA) measurements. The probes and lead-in traces are easily de-embedded. It is interesting to see that a complex 3D structure can sometimes be modeled by a simple transmission line
Keywords :
ball grid arrays; cascade networks; coupled transmission lines; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; network analysers; optimisation; transmission line theory; BGA package; RLGC parameter extraction; VNA measurement optimization; cascaded transmission lines; complex 3D structure model; de-embedded lead-in traces; de-embedded probes; frequency-dependent coupled transmission lines; input impedance optimization; interconnect characterization; interconnect structure models; lead-in traces; probes; vector network analyzer; vector network analyzer measurements; Circuit testing; Couplings; Frequency; Impedance measurement; Integrated circuit interconnections; Mathematical model; Probes; Transmission line matrix methods; Transmission line measurements; Transmission line theory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
Type :
conf
DOI :
10.1109/EPEP.2000.895504
Filename :
895504
Link To Document :
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