Title :
Low impedance power planes with self damping
Author :
Novak, Istvan ; Smith, Larry ; Roy, Tanmoy
Author_Institution :
SUN Microsyst. Inc., Burlington, MA, USA
Abstract :
With the rapid increase of chip clock frequencies and power, the power distribution on printed-circuit boards must rely increasingly on power-ground plane pairs. The effects of dielectric thickness, dielectric constant, and parallel connection of power-ground plane pairs is discussed. It is shown that dielectric materials thinner than 0.5 mils naturally tend to suppress plane resonances
Keywords :
dielectric thin films; electric impedance; integrated circuit interconnections; integrated circuit packaging; permittivity; power supply circuits; printed circuits; resonance; PCB power distribution; chip clock frequency; chip power; dielectric constant; dielectric materials; dielectric thickness; low impedance power planes; parallel power-ground plane pair connection; plane resonance suppression; power-ground plane pairs; self damping; Capacitance; Circuits; Damping; Dielectric constant; Dielectric losses; Dielectric materials; Frequency; Impedance; Inductance; Resonance;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895508
