Title :
Modelling differential via holes
Author :
Laermans, Eric ; De Geest, Jan ; De Zutter, Daniël ; Olyslager, Frank ; Sercu, Stefaan ; Morlion, Danny
Author_Institution :
Dept. of Inf. Technol., Ghent Univ., Belgium
Abstract :
With the ever-increasing frequencies of printed circuit board (PCB) interconnections, the role played by via holes is no longer negligible. Thoughtless design of via holes on a board may seriously degrade signal integrity due to reflections, ground bounce, etc. However, the characterisation of via holes has not drawn much attention until now. This paper presents a method for the characterisation of differential via holes as a cascade of capacitances and inductances. Capacitances are computed using FASTCAP and inductances using simple analytical models
Keywords :
capacitance; inductance; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; printed circuit design; FASTCAP; PCB interconnections; analytical models; capacitances; differential via hole modelling; differential via holes; ground bounce; inductances; printed circuit board interconnections; reflections; signal integrity; via hole characterisation; via hole design; via holes; Analytical models; Capacitance; Computational modeling; Couplings; Finite difference methods; Frequency; Inductance; Information technology; Integral equations; Time domain analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895509
