DocumentCode
2780160
Title
Library development process for embedded capacitors in LTCC
Author
Blood, William ; Ling, Feng ; Myers, Thomas ; Petras, Michael
Author_Institution
Motorola Inc., Tempe, AZ, USA
fYear
2000
fDate
2000
Firstpage
147
Lastpage
150
Abstract
RF modules are building blocks for future wireless communication products. A process that combines electromagnetic (EM) simulation with measurement data provides a means to develop circuit simulation libraries for embedded passive components in low temperature cofired ceramic (LTCC) substrates
Keywords
ceramic capacitors; ceramic packaging; circuit simulation; electromagnetic field theory; modules; EM simulation; LTCC; RF modules; circuit simulation libraries; electromagnetic simulation; embedded capacitors; embedded passive components; low temperature cofired ceramic substrates; measurement data; simulation library development process; wireless communication products; Capacitors; Circuit simulation; Costs; Integrated circuit interconnections; Libraries; Parasitic capacitance; Printed circuits; Product design; Radio frequency; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location
Scottsdale, AZ
Print_ISBN
0-7803-6450-3
Type
conf
DOI
10.1109/EPEP.2000.895514
Filename
895514
Link To Document