Title :
Preserving isolation in grounded coplanar waveguide circuits without via holes
Author :
Hou, Bin ; Jackson, Robert W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
Abstract :
This paper presents a method for achieving good isolation in grounded coplanar waveguide (GCPW) integrated circuits at millimeter-wave frequencies without using via holes or flip-chip packaging. Measurements of a scale model verify this method and agree well with an approximate theoretical analysis and simulations
Keywords :
MIMIC; circuit simulation; coplanar waveguides; earthing; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; isolation technology; flip-chip packaging; grounded coplanar waveguide ICs; grounded coplanar waveguide circuits; grounded coplanar waveguide integrated circuits; isolation; isolation preservation; millimeter-wave GCPW ICs; scale model measurements; simulations; via holes; Circuit simulation; Coplanar waveguides; Feeds; Frequency estimation; Grounding; MMICs; Millimeter wave technology; RLC circuits; Resistors; Resonance;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895542
