• DocumentCode
    2780759
  • Title

    Compact implementation of component library in LTCC technology and its application to CMOS RF power amplifier design

  • Author

    Sutono, A. ; Heo, D. ; Chen, E. ; Lim, K. ; Laskar, J.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    288
  • Lastpage
    291
  • Abstract
    We present the implementation and characterization of an integrated component library in low temperature cofired ceramic (LTCC) technology. Measured inductor Q factor as high as 100 and self-resonant-frequency (SRF) as high as 8 GHz have been demonstrated. The new vertically interdigitated capacitor (VIC) topology occupies nearly an order of magnitude less real estate while demonstrating comparable performance to the conventional topology. The library components have been incorporated in a 1.9 GHz CMOS power amplifier with measured 16 dB gain, 25 dBm output power and 40% power added efficiency (PAE). This is the first demonstration of a CMOS RF power amplifier circuit with fully integrated LTCC passives
  • Keywords
    CMOS analogue integrated circuits; MMIC power amplifiers; Q-factor; UHF power amplifiers; ceramic capacitors; ceramic packaging; circuit CAD; inductors; integrated circuit measurement; network topology; 1.9 GHz; 16 dB; 40 percent; 8 GHz; CMOS RF power amplifier circuit; CMOS RF power amplifier design; CMOS power amplifier; LTCC technology; VIC topology; component library; inductor Q factor; integrated LTCC passives; integrated component library; library components; low temperature cofired ceramic technology; measured gain; output power; power added efficiency; self-resonant-frequency; vertically interdigitated capacitor topology; Capacitors; Ceramics; Inductors; Libraries; Power amplifiers; Q factor; Q measurement; Radiofrequency amplifiers; Temperature; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
  • Conference_Location
    Scottsdale, AZ
  • Print_ISBN
    0-7803-6450-3
  • Type

    conf

  • DOI
    10.1109/EPEP.2000.895547
  • Filename
    895547