DocumentCode :
2780794
Title :
Military Multichip Module Packaging Design And Manufacture
Author :
Cleveland, C. ; Pietila, D. ; Rassaian, M. ; White, T.
Author_Institution :
Boeing Defense & Space Group
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
211
Lastpage :
218
Keywords :
Assembly; Bonding; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Manufacturing; Multichip modules; Space technology; Substrates; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639893
Filename :
639893
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2780794
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