DocumentCode
2781141
Title
Screening ICs On The Bare Chip Level: Temporary Packaging
Author
Chu, D. ; Reber, C.A. ; Palmer, D.W.
Author_Institution
Sandia National Laboratories
fYear
1992
fDate
28-30 Sep 1992
Firstpage
223
Lastpage
226
Keywords
Assembly; Bonding; Electronics packaging; Integrated circuit packaging; Integrated circuit testing; Microassembly; Multichip modules; Packaging machines; Protection; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN
0-7803-0755-0
Type
conf
DOI
10.1109/IEMT.1992.639895
Filename
639895
Link To Document