Packaged micromechanical sensors

Author

Esashi, Masayoshi ; Minami, Kazuyuki

Author_Institution

Fac. of Eng., Tohoku Univ., Sendai, Japan

fYear

1994

fDate

6-10 Nov. 1994

Firstpage

30

Lastpage

37

Abstract

Packaged micro mechanical sensors were fabricated using glass-silicon anodic bonding and an electrical feedthrough structure. Two parallel plates which can be used not only for capacitive sensors but also electrostatic actuators are adopted for integrated sensors as capacitive pressure sensors, accelerometers and resonating sensors. Micromaching technologies were developed for these packaged micro sensors. These include laser assisted silicon etching and anodic bonding which enables to incorporate a circuit inside the package and to keep a sealed cavity at a high vacuum.<>

Keywords

acceleration measurement; accelerometers; laser beam etching; microactuators; micromachining; microsensors; pressure sensors; accelerometers; anodic bonding; capacitive pressure sensors; electrical feedthrough structure; electrostatic actuators; glass-silicon anodic bonding; high vacuum; integrated sensors; laser assisted silicon etching; micromaching technologies; packaged micromechanical sensors; resonating sensors; sealed cavity; Accelerometers; Bonding; Capacitive sensors; Electrostatic actuators; Etching; Integrated circuit technology; Mechanical sensors; Micromechanical devices; Packaging; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Emerging Technologies and Factory Automation, 1994. ETFA '94., IEEE Symposium on

Conference_Location

Tokyo, Japan

Print_ISBN

0-7803-2114-6

Type

conf

DOI

10.1109/ETFA.1994.402027

Filename

402027