Title :
Failure Modes & Effective Analysis And Continuous Improvement
Author :
Hatty, Mark ; Owens, Norm
Author_Institution :
Motorola Inc.
Keywords :
Aerospace industry; Chemical industry; Continuous improvement; Electronic packaging thermal management; Electronics industry; Failure analysis; Manufacturing processes; Microassembly; Process design; Thermal conductivity;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
DOI :
10.1109/IEMT.1992.639899