DocumentCode
2782351
Title
Estimation of NBTI Degradation using IDDQ Measurement
Author
Kang, Kunhyuk ; Alam, Muhammad Ashraful ; Roy, Kaushik
Author_Institution
Purdue Univ., West Lafayette, IN
fYear
2007
fDate
15-19 April 2007
Firstpage
10
Lastpage
16
Abstract
Negative bias temperature instability (NBTI) has emerged as a major reliability degradation factor in nano-scale CMOS technology. In this paper, we analyze the impact of NBTI degradation in both the maximum operating frequency (fMAX) and the total standby leakage current (IDDQ) of digital CMOS circuits. Our analysis shows that due to NBTI, both fMAX and IDDQ reduce with time with a fix exponent of 1/6 (~t1/6). Based on this analysis, we develop temporal fMAX-IDDQ model and apply it to several ISCAS´85 benchmark circuits designed using BPTM 70nm file. Results show that fMAX and IDDQ can reduce by more than 8% and 30% in 3 years operation time, respectively. Furthermore, we show that fMAX and IDDQ degradations are highly correlated throughout the operating lifetime, and using this fact, one can avoid expensive fMAX testing and predict fMAX degradations as a function of IDDQ measures.
Keywords
MOSFET; electric current measurement; leakage currents; semiconductor device measurement; semiconductor device reliability; 70 nm; IDDQ measurement; NBTI degradation; digital CMOS circuits; leakage current; nanoscale CMOS technology; negative bias temperature instability; reliability degradation factor; temporal reliability; CMOS digital integrated circuits; CMOS technology; Circuit analysis; Degradation; Frequency; Leakage current; Life testing; Negative bias temperature instability; Niobium compounds; Titanium compounds; IDDQ; NBTI; Temporal Reliability; fMAX;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location
Phoenix, AZ
Print_ISBN
1-4244-0919-5
Electronic_ISBN
1-4244-0919-5
Type
conf
DOI
10.1109/RELPHY.2007.369861
Filename
4227602
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