• DocumentCode
    2782351
  • Title

    Estimation of NBTI Degradation using IDDQ Measurement

  • Author

    Kang, Kunhyuk ; Alam, Muhammad Ashraful ; Roy, Kaushik

  • Author_Institution
    Purdue Univ., West Lafayette, IN
  • fYear
    2007
  • fDate
    15-19 April 2007
  • Firstpage
    10
  • Lastpage
    16
  • Abstract
    Negative bias temperature instability (NBTI) has emerged as a major reliability degradation factor in nano-scale CMOS technology. In this paper, we analyze the impact of NBTI degradation in both the maximum operating frequency (fMAX) and the total standby leakage current (IDDQ) of digital CMOS circuits. Our analysis shows that due to NBTI, both fMAX and IDDQ reduce with time with a fix exponent of 1/6 (~t1/6). Based on this analysis, we develop temporal fMAX-IDDQ model and apply it to several ISCAS´85 benchmark circuits designed using BPTM 70nm file. Results show that fMAX and IDDQ can reduce by more than 8% and 30% in 3 years operation time, respectively. Furthermore, we show that fMAX and IDDQ degradations are highly correlated throughout the operating lifetime, and using this fact, one can avoid expensive fMAX testing and predict fMAX degradations as a function of IDDQ measures.
  • Keywords
    MOSFET; electric current measurement; leakage currents; semiconductor device measurement; semiconductor device reliability; 70 nm; IDDQ measurement; NBTI degradation; digital CMOS circuits; leakage current; nanoscale CMOS technology; negative bias temperature instability; reliability degradation factor; temporal reliability; CMOS digital integrated circuits; CMOS technology; Circuit analysis; Degradation; Frequency; Leakage current; Life testing; Negative bias temperature instability; Niobium compounds; Titanium compounds; IDDQ; NBTI; Temporal Reliability; fMAX;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    1-4244-0919-5
  • Electronic_ISBN
    1-4244-0919-5
  • Type

    conf

  • DOI
    10.1109/RELPHY.2007.369861
  • Filename
    4227602