DocumentCode
2782935
Title
Development Of An Alternative Wire Bond Test Technique
Author
Lall, Pradeep ; Barker, Donald ; Pecht, Michael
Author_Institution
University of Maryland
fYear
1992
fDate
28-30 Sep 1992
Firstpage
283
Lastpage
287
Keywords
Bonding forces; Educational institutions; Electronic equipment testing; Electronics packaging; Geometry; Inspection; Process control; Quality assurance; Ultra large scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN
0-7803-0755-0
Type
conf
DOI
10.1109/IEMT.1992.639905
Filename
639905
Link To Document