DocumentCode
2783114
Title
Ballistic phonon enhanced NBTI
Author
Wang, Y. ; Cheung, K.P. ; Oates, A. ; Mason, P.
Author_Institution
Dept. of ECE, Rutgers Univ., Newark, NJ
fYear
2007
fDate
15-19 April 2007
Firstpage
258
Lastpage
263
Abstract
Advanced integrated circuit has thermal energy removal issue due to heat dissipated by current at the drain junction of MOSFET. This is a problem only when millions of transistors are generating the thermal energy. In sub-100nm CMOS technology where the transistor channel lengths are smaller than the phonon scattering mean-free-path, a new kind of drain junction heating problem arises due to ballistic phonon effect. This new heating problem exists even when there is only one transistor operating. The impact of this new heating phenomenon on long term reliability of transistor is examined for the first time here. We show that NBTI in pMOS is severely worsened.
Keywords
CMOS integrated circuits; MOSFET; ballistic transport; cooling; phonons; semiconductor device reliability; CMOS technology; MOSFET; NBTI; advanced integrated circuits; ballistic phonon effect; drain junction heating; heat dissipation; negative bias temperature instability; phonon scattering mean-free-path; thermal energy removal; Acoustic scattering; CMOS technology; Heating; MOSFET circuits; Niobium compounds; Phonons; Temperature sensors; Thermal conductivity; Titanium compounds; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location
Phoenix, AZ
Print_ISBN
1-4244-0919-5
Electronic_ISBN
1-4244-0919-5
Type
conf
DOI
10.1109/RELPHY.2007.369902
Filename
4227643
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