DocumentCode :
2783180
Title :
A Fine Pitch And High Aspect Ratio Bump Array For Flip-chip Interconnection
Author :
Yamada, Hiroshi ; Konooh, Y. ; Saito, Masayuki
Author_Institution :
Toshiba Corporation
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
288
Lastpage :
292
Keywords :
Aluminum; Capacitive sensors; Copper; Fabrication; Integrated circuit interconnections; Large scale integration; Polyimides; Resists; Substrates; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639906
Filename :
639906
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2783180
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