DocumentCode

2783187

Title

Description of a wire bonder using a laser as a welding agent

Author

Eggelaar, J.A.

Author_Institution

Microtronic GabH

fYear

1992

fDate

1992

Firstpage

141

Lastpage

145

Keywords

Aluminum; Bonding; Circuits; Connectors; Copper; Electronics packaging; Surface-mount technology; Switches; Welding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International

Print_ISBN

0-7803-0629-5

Type

conf

DOI

10.1109/IEMT.1992.763404

Filename

763404