DocumentCode :
2783187
Title :
Description of a wire bonder using a laser as a welding agent
Author :
Eggelaar, J.A.
Author_Institution :
Microtronic GabH
fYear :
1992
fDate :
1992
Firstpage :
141
Lastpage :
145
Keywords :
Aluminum; Bonding; Circuits; Connectors; Copper; Electronics packaging; Surface-mount technology; Switches; Welding; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
Type :
conf
DOI :
10.1109/IEMT.1992.763404
Filename :
763404
Link To Document :
بازگشت