DocumentCode
2783230
Title
Solder paste displacement on component placement
Author
Donoghue, J.G. ; Williams, D.J.
Author_Institution
Loughborough University of Technology
fYear
1992
fDate
1992
Firstpage
177
Lastpage
183
Keywords
Apertures; Circuit testing; Geometry; Lead; Metalworking machines; Printed circuits; Printing machinery; Pulp manufacturing; Steel; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN
0-7803-0629-5
Type
conf
DOI
10.1109/IEMT.1992.763408
Filename
763408
Link To Document