DocumentCode :
2783230
Title :
Solder paste displacement on component placement
Author :
Donoghue, J.G. ; Williams, D.J.
Author_Institution :
Loughborough University of Technology
fYear :
1992
fDate :
1992
Firstpage :
177
Lastpage :
183
Keywords :
Apertures; Circuit testing; Geometry; Lead; Metalworking machines; Printed circuits; Printing machinery; Pulp manufacturing; Steel; Surface-mount technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
Type :
conf
DOI :
10.1109/IEMT.1992.763408
Filename :
763408
Link To Document :
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