DocumentCode
2783234
Title
Experimental Characterization and Application of Circuit Architecture Level Single Event Transient Mitigation
Author
Mohr, Karl C. ; Clark, Lawrence T.
Author_Institution
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ
fYear
2007
fDate
15-19 April 2007
Firstpage
312
Lastpage
317
Abstract
In this work experimental characterization of process single event transient (SET) performance as a function of circuit node capacitance and drive strength is described. A test structure fabricated on a 130 nm bulk CMOS process is described. Experimental results from ion beam measurements on the structure are also presented. The results can be used early in the design cycle to limit reliability impact due to SETs. An SRAM design example demonstrates how measured SET data can be used to trade off dynamic power dissipation for improved soft error performance without increasing circuit area.
Keywords
CMOS integrated circuits; SRAM chips; ion beam effects; radiation hardening (electronics); 130 nm; CMOS process; SRAM design; circuit architecture level; drive strength; ion beam measurements; single event transient mitigation; soft error performance; Application specific integrated circuits; Capacitance; Circuit testing; Electronic mail; Error correction; Error correction codes; Ionizing radiation; Latches; Protection; Single event upset;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location
Phoenix, AZ
Print_ISBN
1-4244-0919-5
Electronic_ISBN
1-4244-0919-5
Type
conf
DOI
10.1109/RELPHY.2007.369909
Filename
4227650
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