مرکز منطقه ای اطلاع رساني علوم و فناوري - COB: manufacturing of cost effective

DocumentCode :

2783272

Title :

COB: manufacturing of cost effective - high reliability miniature modules

Author :

Fieseler, M.

Author_Institution :

Philips GmbH

fYear :

1992

fDate :

1992

Firstpage :

192

Lastpage :

196

Keywords :

Bonding; Conductive adhesives; Costs; Flip chip; Gold; Manufacturing; Packaging; Silicon; Soldering; Wire;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International

Print_ISBN :

0-7803-0629-5

Type :

conf

DOI :

10.1109/IEMT.1992.763410

Filename :

763410

Link To Document :