DocumentCode :
2783387
Title :
Comparison of SMT, COB, and MCM technologies on a 68000 CPU
Author :
Miet, J.M. ; Potage, J.
Author_Institution :
Thomson-CSF
fYear :
1992
fDate :
1992
Firstpage :
245
Lastpage :
252
Keywords :
Assembly; Central Processing Unit; Cost function; Data processing; Integrated circuit packaging; Lead; Multichip modules; Nonhomogeneous media; Packaging machines; Surface-mount technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
Type :
conf
DOI :
10.1109/IEMT.1992.763417
Filename :
763417
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2783387
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