DocumentCode
2783474
Title
Process and technology choices for manufacturing high density interconnections on silicon surstrates for multichip modules
Author
Davies, M.J. ; Logan, E.A. ; Munns, A.G. ; Pedder, L. D J
Author_Institution
GEC-Marconi Materials Technology Ltd
fYear
1992
fDate
1992
Firstpage
286
Lastpage
293
Keywords
Assembly; Dielectric substrates; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Manufacturing processes; Metal-insulator structures; Silicon; Surface-mount technology; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN
0-7803-0629-5
Type
conf
DOI
10.1109/IEMT.1992.763422
Filename
763422
Link To Document