DocumentCode
2783497
Title
Developnent of solder bump fabrication in multicalp modules
Author
Okuyam, S. ; Nitta, Tom ; Kanno, Tatoo ; Terashima, M.
Author_Institution
Fujitsu Limited
fYear
1992
fDate
1992
Firstpage
315
Lastpage
320
Keywords
Adhesives; Bonding; Fabrication; Hybrid integrated circuits; Integrated circuit reliability; Integrated circuit technology; Manufacturing; Mass production; Multichip modules; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN
0-7803-0629-5
Type
conf
DOI
10.1109/IEMT.1992.763424
Filename
763424
Link To Document