DocumentCode :
2783497
Title :
Developnent of solder bump fabrication in multicalp modules
Author :
Okuyam, S. ; Nitta, Tom ; Kanno, Tatoo ; Terashima, M.
Author_Institution :
Fujitsu Limited
fYear :
1992
fDate :
1992
Firstpage :
315
Lastpage :
320
Keywords :
Adhesives; Bonding; Fabrication; Hybrid integrated circuits; Integrated circuit reliability; Integrated circuit technology; Manufacturing; Mass production; Multichip modules; Soldering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
Type :
conf
DOI :
10.1109/IEMT.1992.763424
Filename :
763424
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2783497
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