• DocumentCode
    2783567
  • Title

    Pb-free Soldering Alternatives For Fine Pitched Electronics Packaging

  • Author

    Felton, L.E. ; Raeder, C.H. ; Havasy, C.K. ; Knorr, D.B.

  • Author_Institution
    Rensselaer Polytechnic Institute
  • fYear
    1992
  • fDate
    28-30 Sep 1992
  • Firstpage
    300
  • Lastpage
    304
  • Keywords
    Capacitive sensors; Electronics industry; Electronics packaging; Fatigue; Manufacturing; Powders; Productivity; Soldering; Surface emitting lasers; Technology transfer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
  • Print_ISBN
    0-7803-0755-0
  • Type

    conf

  • DOI
    10.1109/IEMT.1992.639908
  • Filename
    639908
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2783567